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6.7 How Secure and Verified is your Cyber-Physical System?.6.6 Intelligent Wearable and Implantable Sensors for Augmented Living.6.4 Hardware support for microarchitecture performance.6.3 When Approximation Meets Dependability.6.2 Special Session: 3D Sensor - Hardware to Application.6.1 Special Day on "Embedded Meets Hyperscale and HPC" Session: Near-memory computing.5.8 Special Session: The ARAMiS II Project - Efficient Use of Multicore for safety-critical Applications.5.6 Energy efficiency in IoT - Edge to Cloud.5.4 Emerging technologies for better NoCs.

5.2 Improving Formal Verification and Applications to GPUs and High-Level Synthesis.

5.1 Special Day on "Embedded Meets Hyperscale and HPC" Session: Heterogeneous Computing in the Datacenter and in HPC.

Exhibition-Reception Exhibition Reception.

4.8 Embedded Tutorial: Paving the Way for Very Large Scale Integration of Superconductive Electronics.

4.7 Energy and power efficiency in GPU-based systems.

4.6 Smart Communication Solutions for Automotive Systems.

4.5 Hardware Trojans and Split Manufacturing.

4.4 Digital processing with emerging memory technologies.

4.3 Improving test generation and coverage.

4.2 Reconfigurable Architecture and Tools.

4.1 Executive Session 3: The Future of Test.

3ps.8 Publisher´s Session: How to Publish Your Research Work.

3.8 DFG Collaborative Funding Instruments.

3.7 Design Automation of Cyber-Physical Systems.

3.6 Software Solutions for Reliable Memories.

3.5 Hardware authentication and attack prevention.

3.4 Physical Design, Extraction and Timing Analysis.

3.3 Methods and Characterisation techniques for Reliability.

3.2 Special Session: Smart Resource Management and Design Space Exploration for Heterogenous Processors.

3.1 Executive Session 2: Panel "Semiconductor IP, Surfing the Next Big Wave".

2.8 How Electronic Systems can benefit from Machine Learning and from ESD Alliance.

2.7 Analysis and optimization techniques for neural networks.

2.6 Computational and resource-efficiency in quantum and approximate computing.

2.5 Solutions for reliability and security of mixed-signal circuits.

2.4 Temperature and Variability Driven Modeling and Runtime Management.

2.3 Special Session: Circuit design and design automation for flexible electronics.

2.1 Executive Session 1: Panel "Life After CMOS".

1.1 Opening Session: Plenary, Awards Ceremony & Keynote Addresses.